Blueprint studio · Spec sheets · Amber callouts · Free shipping over $75
Sheet A · Product board
Unit price
USD16.55
USD49.55

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Field rating
4.0

Verified studio score · Spec revision current

Fit · Size

LUOWEI HS3 Preheating Platform Phone PCB Layering IC Glue Remover Oscilloscope OCA Lamination And Screen Alignment

SKU: 96899094482

Dispatch

Shipping Estimate
USA
  • USA
  • CAN

Ships within 48 hours · Estimated delivery Aug 25 - Aug 30

Description

OCA Lamination And Screen Alignment 2 In 1 Mold for iPhone X/XS

Color: Grey + Blue

vacuum time

and the temperature can be adjusted from 50 to 130 °C

1)  Use Sony IMX317 Sensor

LUOWEI HS3 Preheating Platform Phone PCB Layering IC Glue Remover Oscilloscope OCA Lamination And Screen AlignmentLuowei HS3 Uniform Preheat Platform Phone Motherboard CPU IC Heating Plate for mobile phone PCB board layering laminating chip glue removal, etc. Luowei HS3 99W constant temperature control preheating platform 65mm*100mm heating size suitable for various mobile phone motherboards tinning, degumming, and laminating, etc. Features: 1. Material construction: Made of aviation aluminum alloy, it not only improves durability but also ensures efficient

Exchange/Return Notes
  • We offer a 30-day return/exchange service after receiving.
  • Final sale items are not eligible for returns or exchanges.
  • To process your return/exchange, please contact us at [email protected]
  • Please click here for more details>>> Return & Exchange Policy

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